Multi-Objective Analysis and Optimization of Integrated Cooling in Micro-Electronics With Hot Spots
Master of Science (MS)
First Advisor's Name
George S. Dulikravich
First Advisor's Committee Title
Second Advisor's Name
Second Advisor's Committee Title
Third Advisor's Name
Third Advisor's Committee Title
Fourth Advisor's Name
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Fifth Advisor's Name
Fifth Advisor's Committee Title
Multi-Objective Optimization, Electronic Cooling, High Heat Flux, Micro Pin-Fins, Inverse Design, Heat Spreaders
Date of Defense
With the demand of computing power from electronic chips on a constant rise, innovative methods are needed for effective and efficient thermal management. Forced convection cooling through an array of micro pin-fins acts not only as a heat sink, but also allows for the electrical interconnection between stacked layers of integrated circuits. This work performs a multi-objective optimization of three shapes of pin-fins to maximize the efficiency of this cooling system. An inverse design approach that allows for the design of cooling configurations without prior knowledge of thermal mapping was proposed and validated. The optimization study showed that pin-fin configurations are capable of containing heat flux levels of next generation electronic chips. It was also shown that even under these high heat fluxes the structural integrity is not compromised. The inverse approach showed that configurations exist that are capable of cooling heat fluxes beyond those of next generation chips. Thin film heat spreaders made of diamond and graphene nano-platelets were also investigated and showed that further reduction in maximum temperature, increase in temperature uniformity and reduction in thermal stresses are possible.
Reddy, Sohail R., "Multi-Objective Analysis and Optimization of Integrated Cooling in Micro-Electronics With Hot Spots" (2015). FIU Electronic Theses and Dissertations. 2205.
Aerodynamics and Fluid Mechanics Commons, Heat Transfer, Combustion Commons, Systems Engineering and Multidisciplinary Design Optimization Commons
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