Document Type

Dissertation

Degree

Doctor of Philosophy

Department

Mechanical Engineering

Advisor's Name

Dr. W. Kinzy Jones

Advisor's Title

Committee Chair

Advisor's Name

Dr. Yiding Cao

Advisor's Title

Committee Member

Keywords

cofired, heat pipe, thermal management, ceramic

Date of Defense

4-18-2001

Abstract

A novel and new thermal management technology for advanced ceramic microelectronic packages has been developed incorporating miniature heat pipes embedded in the ceramic substrate. The heat pipes use an axially grooved wick structure and water as the working fluid. Prototype substrate/heat pipe systems were fabricated using high temperature co-fired ceramic (alumina). The heat pipes were nominally 81 mm in length, 10 mm in width, and 4 mm in height, and were charged with approximately 50-80 mL of water. Platinum thick film heaters were fabricated on the surface of the

substrate to simulate heat dissipating electronic components. Several thermocouples were affixed to the substrate to monitor temperature. One end of the substrate was affixed to a heat sink maintained at constant temperature. The prototypes were tested and shown to successful and reliably operate with thermal loads over 20 Watts, with thermal input from single and multiple sources along the surface of the substrate. Temperature distributions are discussed for the various configurations and the effective thermal resistance of the substrate/heat pipe system is calculated. Finite

element analysis was used to support the experimental findings and better understand the sources of the system's thermal resistance.


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