Multi-Objective Analysis and Optimization of Integrated Cooling in Micro-Electronics With Hot Spots

Authors

Sohail R. Reddy, Florida International UniversityFollow

Document Type

Thesis

Degree

Master of Science (MS)

Major/Program

Mechanical Engineering

First Advisor's Name

George S. Dulikravich

First Advisor's Committee Title

Committee Chair

Second Advisor's Name

Arvind Agarwal

Second Advisor's Committee Title

Committee Member

Third Advisor's Name

Yiding Cao

Third Advisor's Committee Title

Committee Member

Fourth Advisor's Name

Bilal El-Zahab

Fourth Advisor's Committee Title

Committee Member

Fifth Advisor's Name

Sakhrat Khizroev

Fifth Advisor's Committee Title

Committee Member

Keywords

Multi-Objective Optimization, Electronic Cooling, High Heat Flux, Micro Pin-Fins, Inverse Design, Heat Spreaders

Date of Defense

6-12-2015

Abstract

With the demand of computing power from electronic chips on a constant rise, innovative methods are needed for effective and efficient thermal management. Forced convection cooling through an array of micro pin-fins acts not only as a heat sink, but also allows for the electrical interconnection between stacked layers of integrated circuits. This work performs a multi-objective optimization of three shapes of pin-fins to maximize the efficiency of this cooling system. An inverse design approach that allows for the design of cooling configurations without prior knowledge of thermal mapping was proposed and validated. The optimization study showed that pin-fin configurations are capable of containing heat flux levels of next generation electronic chips. It was also shown that even under these high heat fluxes the structural integrity is not compromised. The inverse approach showed that configurations exist that are capable of cooling heat fluxes beyond those of next generation chips. Thin film heat spreaders made of diamond and graphene nano-platelets were also investigated and showed that further reduction in maximum temperature, increase in temperature uniformity and reduction in thermal stresses are possible.

Identifier

FIDC000094

Recommended Citation

Reddy, Sohail R., "Multi-Objective Analysis and Optimization of Integrated Cooling in Micro-Electronics With Hot Spots" (2015). FIU Electronic Theses and Dissertations. 2205.
https://digitalcommons.fiu.edu/etd/2205